US 11,693,045 B2
Testing module and testing method using the same
Hao Chen, New Taipei (TW); and Mill-Jer Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Aug. 9, 2022, as Appl. No. 17/884,487.
Application 17/884,487 is a continuation of application No. 16/805,874, filed on Mar. 2, 2020.
Claims priority of provisional application 62/893,792, filed on Aug. 29, 2019.
Prior Publication US 2022/0381817 A1, Dec. 1, 2022
Int. Cl. G01R 31/27 (2006.01); G01R 1/04 (2006.01)
CPC G01R 31/275 (2013.01) [G01R 1/0466 (2013.01); G01R 1/0491 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A testing module for a semiconductor wafer-form package, comprising:
a circuit board structure, comprising two edge regions and a main region disposed therebetween;
first connectors, disposed over the edge regions and mechanically connected to the circuit board structure;
a first connecting structure, disposed over and distant from the circuit board structure;
second connectors and third connectors, disposed over and mechanically connected to the first connecting structure, wherein the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region; and
a first bridge connector, electrically coupling the circuit board structure and the first connecting structure by contacting the second connectors and the first connectors,
wherein the semiconductor wafer-form package is surrounded by the circuit board structure, the first connectors, the first connecting structure, the second connectors, the third connectors, and the first bridge connector.