US 11,693,043 B2
Test head assembly for semiconductor device
Ying-Tang Chao, Hukou Township, Hsinchu County (TW); Yen-Yu Chen, Hukou Township, Hsinchu County (TW); and Shin-Kung Chen, Hukou Township, Hsinchu County (TW)
Assigned to Powertech Technology Inc., Hukou Township (TW)
Filed by Powertech Technology Inc., Hukou Township, Hsinchu County (TW)
Filed on Sep. 3, 2021, as Appl. No. 17/467,045.
Claims priority of application No. 110113998 (TW), filed on Apr. 19, 2021.
Prior Publication US 2022/0334168 A1, Oct. 20, 2022
Int. Cl. G01R 31/26 (2020.01); G01R 1/073 (2006.01)
CPC G01R 31/2601 (2013.01) [G01R 1/07314 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A test head assembly for a semiconductor device, comprising:
a carrier substantially having:
a lateral board;
a perpendicular board connected to the lateral board to form in an L shape, and
at least one opening formed through the perpendicular board;
at least one pin seat mounted in the corresponding opening, substantially perpendicular to the lateral board, and having a plurality of pins, wherein each of the pins has an inner end and an outer end, the inner ends protrude from an inside of the perpendicular board, and the outer ends protrude from an outside of the perpendicular board; and
a test wire assembly having:
a test head mounted on an outer sidewall of the lateral board and having a plurality of micro-probes;
a plurality of connectors respectively connected to the outer ends of the pins of the at least one pin seat; and
a plurality of test wires respectively connected between the micro-probes and the connectors and positioned alongside the outer sidewall of the lateral board and the outside of the perpendicular board.