US 11,692,892 B2
MEMS pressure sensor and method for forming the same
Manhing Chau, Tianjin (CN)
Assigned to MEMSEN ELECTRONICS INC., Tianjin (CN)
Filed by MEMSEN ELECTRONICS INC, Tianjin (CN)
Filed on Apr. 9, 2021, as Appl. No. 17/226,178.
Application 17/226,178 is a division of application No. 16/387,944, filed on Apr. 18, 2019, granted, now 11,002,626.
Application 16/387,944 is a division of application No. 15/013,382, filed on Feb. 2, 2016, abandoned.
Claims priority of application No. 201510084520.X (CN), filed on Feb. 16, 2015.
Prior Publication US 2021/0239556 A1, Aug. 5, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G01P 15/08 (2006.01); G01L 9/00 (2006.01)
CPC G01L 9/0073 (2013.01) [G01L 9/0042 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming a Micro-Electro Mechanical System (MEMS) pressure sensor, comprising:
preparing a first substrate, wherein the first substrate comprises a first surface and a second surface opposite to the first surface, and the first substrate comprises one or more conductive layers arranged on the side of the first surface of the first substrate;
preparing a second substrate, wherein the second substrate comprises a third surface and a fourth surface opposite to the third surface, the second substrate comprises a second base and a pressure-sensing electrode arranged on or above the second base, the second substrate comprises a pressure sensing region in which the pressure-sensing electrode is arranged, and the pressure-sensing electrode is arranged on the side of the third surface of the second substrate;
bonding the first surface of the first substrate and the third surface of the second substrate with each other and form a substrate bonding interface;
forming a cavity between the first substrate and the pressure sensing region of the second substrate;
removing the second base to form a fifth surface opposite to the third surface of the second substrate; and
forming a first conductive plug passing through the second substrate from the side of the fifth surface of the second substrate to at least one of the conductive layers, wherein the first conductive plug is used to electrically connect the conductive layer to the pressure-sensing electrode.