US 11,691,424 B2
Liquid ejection head, and liquid ejection device
Takayuki Kamimura, Kanagawa (JP); and Michiko Johnson, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Oct. 26, 2021, as Appl. No. 17/511,096.
Claims priority of application No. 2020-182084 (JP), filed on Oct. 30, 2020.
Prior Publication US 2022/0134755 A1, May 5, 2022
Int. Cl. B41J 2/16 (2006.01)
CPC B41J 2/1623 (2013.01) [B41J 2/1626 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A liquid ejection head configured by bonding a plurality of substrates, the head comprising:
an ejection orifice from which a liquid is ejected;
a first flow passage which penetrates a bonding surface between the plurality of substrates and through which a liquid flows;
a second flow passage which penetrates the bonding surface and through which a liquid different from the liquid flowing through the first flow passage flows; and
an in-partition wall space which is provided in a partition wall for separating the first flow passage and the second flow passage and is open to the bonding surface, wherein
an internal pressure of the in-partition wall space is lower than any of pressures of the liquids in the first flow passage and the second flow passage.