CPC B41J 2/1623 (2013.01) [B41J 2/1626 (2013.01)] | 15 Claims |
1. A liquid ejection head configured by bonding a plurality of substrates, the head comprising:
an ejection orifice from which a liquid is ejected;
a first flow passage which penetrates a bonding surface between the plurality of substrates and through which a liquid flows;
a second flow passage which penetrates the bonding surface and through which a liquid different from the liquid flowing through the first flow passage flows; and
an in-partition wall space which is provided in a partition wall for separating the first flow passage and the second flow passage and is open to the bonding surface, wherein
an internal pressure of the in-partition wall space is lower than any of pressures of the liquids in the first flow passage and the second flow passage.
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