US 11,691,320 B2
Apparatus and method for molding a foam pad with a wire assembly
Christopher John Meurer, Taylorsville, KY (US); Ricky Brown, Louisville, KY (US); Bryan Keith Caskey, Coxs Creek, KY (US); and Russel Eugene Strang, Danville, KY (US)
Assigned to Magna Seating Inc, Aurora (CA)
Filed by Magna Seating Inc, Aurora (CA)
Filed on Apr. 8, 2020, as Appl. No. 16/842,912.
Claims priority of provisional application 62/831,432, filed on Apr. 9, 2019.
Prior Publication US 2020/0324443 A1, Oct. 15, 2020
Int. Cl. B29C 44/58 (2006.01); B29C 44/12 (2006.01)
CPC B29C 44/1266 (2013.01) [B29C 44/58 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An apparatus for molding a foam pad with a wire assembly for an automotive vehicle, the apparatus comprising:
a mold bowl having a bottom surface and a peripheral wall extending upwardly therefrom, the peripheral wall encircling the bottom surface and terminating at a top edge of the mold bowl;
a mold lid having a top surface and operably coupled to the mold bowl to define a mold cavity therebetween;
at least one wire holder extending inwardly from the peripheral wall of the mold bowl, the wire holder including an upper ledge for vertically positioning the wire assembly within the mold cavity between the bottom surface of the mold bowl and the top surface of the mold lid; and
a holding element disposed along the upper ledge of the wire holder for horizontally positioning the wire assembly within the mold cavity spaced from the peripheral wall of the mold bowl.