US 10,342,139 B2
Printer and printing method for printing of printed circuit boards
Xue-Qin Zhang, Shenzhen (CN)
Assigned to Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen (CN); and HON HAI PRECISION INDUSTRY CO., LTD., New Taipei (TW)
Filed by Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen (CN); and HON HAI PRECISION INDUSTRY CO., LTD., New Taipei (TW)
Filed on Dec. 7, 2015, as Appl. No. 14/961,201.
Claims priority of application No. 2015 1 0774758 (CN), filed on Nov. 13, 2015.
Prior Publication US 2017/0142843 A1, May 18, 2017
Int. Cl. H05K 3/22 (2006.01); G05B 19/4099 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/12 (2006.01)
CPC H05K 3/22 (2013.01) [G05B 19/4099 (2013.01); H05K 3/0085 (2013.01); H05K 3/0091 (2013.01); H05K 3/0097 (2013.01); H05K 3/1241 (2013.01); H05K 3/1275 (2013.01); H05K 3/4644 (2013.01); G05B 2219/49023 (2013.01); H05K 3/005 (2013.01); H05K 3/125 (2013.01); H05K 3/4611 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A printer comprising:
a belt;
a tray arranged on the belt and configured to receive a printed circuit board (PCB) therein;
a sensor attached to the tray and configured to sense whether the PCB is located in the tray; and
a plurality of processing devices located along the belt;
wherein when the PCB is loaded in the tray, the belt is driven by a driving device to transport the tray below toward each of the plurality of processing devices; and
wherein the plurality of processing devices comprises
a punching device configured to punch the PCB;
a first line printing device, arranged downstream of the punching device and configured to print a conductive line pattern on a first side of the PCB;
a layer printing device, arranged downstream of the line printing device and configure to print a solder layer of the PCB;
a white text and marking printing device, arranged downstream of the layer printing device and configure to print white text and marking on the PCB; and
a solder bump printing device, arranged downstream of the white text and marking printing device and configure to print a solder material onto the PCB.