US 10,342,138 B2
Chip part and manufacturing method thereof
Yasuhiro Kondo, Kyoto (JP); Katsuya Matsuura, Kyoto (JP); and Hiroshi Tamagawa, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Aug. 7, 2017, as Appl. No. 15/670,627.
Claims priority of application No. 2016-155914 (JP), filed on Aug. 8, 2016.
Prior Publication US 2018/0042118 A1, Feb. 8, 2018
Int. Cl. H01L 23/31 (2006.01); H05K 3/00 (2006.01); H01L 21/71 (2006.01); H01L 21/78 (2006.01); H05K 3/04 (2006.01); B23K 1/005 (2006.01); H05K 13/02 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H05K 1/02 (2006.01); H01L 21/66 (2006.01)
CPC H05K 3/045 (2013.01) [B23K 1/0056 (2013.01); H01L 21/6836 (2013.01); H01L 21/71 (2013.01); H01L 21/78 (2013.01); H01L 23/3185 (2013.01); H01L 23/3192 (2013.01); H01L 23/564 (2013.01); H01L 23/66 (2013.01); H01L 24/03 (2013.01); H05K 3/002 (2013.01); H05K 3/0044 (2013.01); H05K 13/024 (2013.01); H01L 22/12 (2013.01); H01L 24/05 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/0348 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/94 (2013.01); H01L 2924/10158 (2013.01); H05K 1/0274 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A chip part comprising:
a substrate having a first main surface on one side thereof and a second main surface on the other side thereof;
a functional device formed at a first main surface side of the substrate;
an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device; and
a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate,
wherein the light diffusion reflection structure is formed by an uneven structure formed at the second main surface side of the substrate, and
the chip part further comprises an insulating film covering the second main surface of the substrate.