US 10,342,134 B2
Printed circuit board and a method of bonding electrode lead of battery to printed circuit board
Jin Oh Yang, Gyeongsangbuk-Do (KR); Suk Jin Song, Gyeonggi-Do (KR); Young Su Son, Chungcheongbuk-Do (KR); and Jae Young Jang, Chungcheongbuk-Do (KR)
Assigned to LG Chem. Ltd., Seoul (KR)
Filed by LG CHEM, LTD., Seoul (KR)
Filed on Feb. 20, 2018, as Appl. No. 15/900,031.
Claims priority of application No. 10-2017-0023351 (KR), filed on Feb. 22, 2017.
Prior Publication US 2018/0242454 A1, Aug. 23, 2018
Int. Cl. H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/18 (2013.01) [H05K 1/111 (2013.01); H05K 3/3405 (2013.01); H05K 3/3421 (2013.01); H05K 3/3447 (2013.01); H05K 3/4015 (2013.01); H05K 1/0204 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10901 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A printed circuit board configured to include a first surface and a second surface facing the first surface, the printed circuit board comprising:
a board;
a plurality of connection parts on the board, each configured to be electrically connected with an electrode lead of a battery;
through holes each on one side of the board on a side from which the electrode lead of the battery is connected, each through hole passing through a respective one of the connection parts and through the board from the first surface to the second surface in a region in which the respective connection part is disposed;
guide holes each passing through a respective one of the connection parts and through the board from the first surface to the second surface in the region in which the respective connection part is disposed; and
a plurality of metal plates each soldered to a respective one of the connection parts and having an upper surface to which the electrode lead of the battery is bonded,
wherein at least one through hole and at least one guide hole pass through each connection part.