US 10,342,074 B2
Distributed transistor-based power supply for supplying heat to a structure
William Preston Geren, Shoreline, WA (US); Stephen Moore, Renton, WA (US); Robert J. Miller, Fall City, WA (US); Mark Negley, Bellvue, WA (US); and Scott D. Billings, Des Moines, WA (US)
Assigned to THE BOEING COMPANY, Chicago, IL (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Jan. 4, 2013, as Appl. No. 13/733,930.
Prior Publication US 2014/0190954 A1, Jul. 10, 2014
Int. Cl. H05B 6/04 (2006.01); H05B 6/06 (2006.01); H05B 6/24 (2006.01); H05B 6/10 (2006.01)
CPC H05B 6/105 (2013.01) [H05B 6/06 (2013.01); H05B 2206/023 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A heating apparatus configured to heat a structure, the heating apparatus comprising:
a housing member;
a plurality of heating elements disposed within the housing member;
a plurality of resonant frequency power sources attached to the housing member and coupled with the plurality of heating elements; and
at least one controller configured to:
determine, based on received temperature information associated with the plurality of heating elements, a plurality of resonant frequencies corresponding to the plurality of heating elements; and
dynamically control, for each of the plurality of resonant frequency power sources, a corresponding drive frequency on and off a respective resonant frequency of the plurality of resonant frequencies to thereby meet a desired temperature profile across the structure.