CPC H05K 1/0293 (2013.01) [H01R 4/02 (2013.01); H01R 12/00 (2013.01); H01R 12/523 (2013.01); H01R 13/717 (2013.01); H05K 1/0266 (2013.01); H05K 1/0269 (2013.01); H05K 1/0292 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 1/113 (2013.01); H05K 1/118 (2013.01); H05K 1/14 (2013.01); H05K 1/144 (2013.01); H05K 3/363 (2013.01); F21Y 2107/30 (2016.08); F21Y 2115/10 (2016.08); H05K 1/147 (2013.01); H05K 3/0061 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2027 (2013.01); H05K 2203/0228 (2013.01)] | 20 Claims |
1. An interconnectable circuit board array, comprising:
a first flexible interconnectable circuit board, comprising:
a conductive layer between two electrically isolating layers;
a first electrically conductive pad disposed on a top surface of the first flexible interconnectable circuit board;
a second electrically conductive pad disposed on the top surface of the first flexible interconnectable circuit board;
a third electrically conductive pad disposed on a top surface of the first flexible interconnectable circuit board;
a fourth electrically conductive pad disposed on the top surface of the first flexible interconnectable circuit board;
a first light emitting diode (LED) of the first flexible interconnectable circuit board disposed on the top surface, wherein the first LED of the first flexible interconnectable circuit board is conductively connected to the conductive layer; and
a first through hole extending from the first electrically conductive pad through the conductive layer to a bottom surface of the first flexible interconnectable circuit board, a second through hole extending from the second electrically conductive pad through the conductive layer to the bottom surface of the first flexible interconnectable circuit board, a third through hole extending from the third electrically conductive pad through the conductive layer to the bottom surface of the first flexible interconnectable circuit board, and a fourth through hole extending from the fourth electrically conductive pad through the conductive layer to the bottom surface of the first flexible interconnectable circuit board; and
a second flexible interconnectable circuit board, comprising:
a conductive layer between two electrically isolating layers;
a first electrically conductive pad disposed on a top surface of the second flexible interconnectable circuit board;
a second electrically conductive pad disposed on the top surface of the second flexible interconnectable circuit board;
a third electrically conductive pad disposed on a top surface of the second flexible interconnectable circuit board;
a fourth electrically conductive pad disposed on the top surface of the second flexible interconnectable circuit board;
a first LED of the second flexible interconnectable circuit board disposed on the top surface, wherein the first LED of the second flexible interconnectable circuit board is conductively connected to the conductive layer; and
a first through hole extending from the first electrically conductive pad through the conductive layer to a bottom surface of the second flexible interconnectable circuit board, a second through hole extending from the second electrically conductive pad through the conductive layer to the bottom surface of the second flexible interconnectable circuit board, a third through hole extending from the third electrically conductive pad through the conductive layer to the bottom surface of the second flexible interconnectable circuit board, and a fourth through hole extending from the fourth electrically conductive pad through the conductive layer to the bottom surface of the second flexible interconnectable circuit board;
wherein the first flexible interconnectable circuit board is arranged with the second flexible interconnectable circuit board such that a longitudinal axis of the first flexible interconnectable circuit board is aligned with a longitudinal axis of the second flexible interconnectable circuit board;
wherein a portion of the first flexible interconnectable circuit board overlaps a portion of the second flexible interconnectable circuit board such that the first electrically conductive pad of the first flexible interconnectable circuit board is at least partially aligned with the third electrically conductive pad of the second flexible interconnectable circuit board, and the second electrically conductive pad of the first flexible interconnectable circuit board is at least partially aligned with the fourth electrically conductive pad of the second flexible interconnectable circuit board;
wherein solder is disposed within the first through hole of the first flexible interconnectable circuit board to conductively connect the first electrically conductive pad of the first flexible interconnectable circuit board with the third electrically conductive pad of the second flexible interconnectable circuit board and solder is disposed within the second through hole of the first flexible interconnectable circuit board to conductively connect the second electrically conductive pad of the first flexible interconnectable circuit board with the fourth electrically conductive pad of the second flexible interconnectable circuit board.
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11. An interconnectable circuit board array, comprising:
a plurality of flexible interconnectable circuit boards connected in series; each flexible interconnectable circuit board of the plurality of flexible interconnectable circuit boards comprises:
a conductive layer between two electrically isolating layers;
a first electrically conductive pad, a second electrically conductive pad, a third electrically conductive pad, and a fourth electrically conductive pad disposed on a top surface of the interconnectable circuit board, wherein the first and second electrically conductive pads are adjacent to a first end of the interconnectable circuit board and disposed on opposite sides of a center axis, and the third and fourth electrically conductive pads are adjacent to a second end of the interconnectable circuit board and disposed on opposite sides of a center axis;
a LED disposed on the top surface, wherein the first LED is conductively connected to the conductive layer; and
a first through hole extending from the first electrically conductive pad through the conductive layer to a bottom surface of the interconnectable circuit board, a second through hole extending from the second electrically conductive pad through the conductive layer to the bottom surface of the interconnectable circuit board; a third through hole extending from the third electrically conductive pad through the conductive layer to the bottom surface of the interconnectable circuit board, and a fourth through hole extending from the fourth electrically conductive pad through the conductive layer to the bottom surface of the interconnectable circuit board; and
wherein a portion of adjacent interconnectable circuit boards overlap such that the first and second electrically conductive pads of one of the interconnectable circuit boards is at least partially aligned with the third and fourth electrically conductive pads of the adjacent interconnectable circuit board;
wherein solder is disposed within the first through hole to conductively connect the first electrically conductive pad of one of the interconnectable circuit boards with the third electrically conductive pad of the adjacent interconnectable circuit board and solder is disposed within the second through hole to conductively connect the second electrically conductive pad of the interconnectable circuit board with the fourth electrically conductive pad of the adjacent interconnectable circuit board.
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16. An interconnectable circuit board array, comprising:
a plurality of flexible interconnectable circuit boards connected in series; each flexible interconnectable circuit board of the plurality of flexible interconnectable circuit boards comprises:
a conductive layer between two electrically isolating layers;
a first electrically conductive pad, a second electrically conductive pad, a third electrically conductive pad, and a fourth electrically conductive pad disposed on a top surface of the interconnectable circuit board, wherein the first and second electrically conductive pads are adjacent to a first end of the interconnectable circuit board and the third and fourth electrically conductive pads are adjacent to a second end of the interconnectable circuit board;
a LED disposed on the top surface, wherein the first LED is conductively connected to the conductive layer; and
a first through hole extending from the first electrically conductive pad through the conductive layer to a bottom surface of the interconnectable circuit board, a second through hole extending from the second electrically conductive pad through the conductive layer to the bottom surface of the interconnectable circuit board; a third through hole extending from the third electrically conductive pad through the conductive layer to the bottom surface of the interconnectable circuit board, and a fourth through hole extending from the fourth electrically conductive pad through the conductive layer to the bottom surface of the interconnectable circuit board;
wherein the adjacent interconnectable circuit boards are arranged such that a longitudinal axis of each interconnectable circuit boards are aligned; and
wherein a portion of adjacent interconnectable circuit boards overlap such that the first and second electrically conductive pads of one of the interconnectable circuit boards is at least partially aligned with the third and fourth electrically conductive pads of the adjacent interconnectable circuit board;
wherein solder is disposed within the first through hole to conductively connect the first electrically conductive pad of one of the interconnectable circuit boards with the third electrically conductive pad of the adjacent interconnectable circuit board and solder is disposed within the second through hole to conductively connect the second electrically conductive pad of the interconnectable circuit board with the fourth electrically conductive pad of the adjacent interconnectable circuit board;
wherein the plurality of flexible interconnectable circuit boards connected in series are wound around a reel.
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