US 11,690,169 B2
Thermal management for thermal cyclers using air tubes
Amir Sadri, Hercules, CA (US); Neven Nikolic, Hercules, CA (US); Gabriel Culinco, Hercules, CA (US); Thanh-Vi Tran, Hercules, CA (US); and Nenad Kircanski, Hercules, CA (US)
Assigned to Bio-Rad Laboratories, Inc., Hercules, CA (US)
Filed by Bio-Rad Laboratories, Inc., Hercules, CA (US)
Filed on Jun. 16, 2022, as Appl. No. 17/841,931.
Application 17/841,931 is a continuation of application No. 17/102,027, filed on Nov. 23, 2020, granted, now 11,375,612.
Claims priority of provisional application 62/939,419, filed on Nov. 22, 2019.
Prior Publication US 2022/0312586 A1, Sep. 29, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/0272 (2013.01) [H05K 7/20145 (2013.01); H05K 7/20163 (2013.01); H05K 7/20209 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01)] 22 Claims
OG exemplary drawing
 
22. A method of thermally cooling a heat pump system, the methods comprising:
operating one or more fans to control airflow from a heat sink thereby cooling the heat sink;
controlling airflow from the heat sink so as to cool the heat sink;
drawing air into a space between two circuit boards in an electronics boards assembly that controls operation of the heat pump, by operating the one or more fans, thereby cooling the electronic board assembly concurrent with cooling of the heat sink; and
isolating airflow from the heat sink from air drawn through the electronics board assembly by a partition.