CPC H05K 1/0272 (2013.01) [H05K 7/20145 (2013.01); H05K 7/20163 (2013.01); H05K 7/20209 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01)] | 22 Claims |
22. A method of thermally cooling a heat pump system, the methods comprising:
operating one or more fans to control airflow from a heat sink thereby cooling the heat sink;
controlling airflow from the heat sink so as to cool the heat sink;
drawing air into a space between two circuit boards in an electronics boards assembly that controls operation of the heat pump, by operating the one or more fans, thereby cooling the electronic board assembly concurrent with cooling of the heat sink; and
isolating airflow from the heat sink from air drawn through the electronics board assembly by a partition.
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