CPC H04N 23/55 (2023.01) [G02B 7/021 (2013.01); H04N 23/45 (2023.01); H04N 23/54 (2023.01)] | 14 Claims |
1. A camera module comprising:
a Printed Circuit Board (PCB);
a first image sensor and a second image sensor disposed on the PCB;
a lens holder having an upper plate facing and spaced apart from the PCB and a sidewall extending from an edge of the upper plate toward the PCB, wherein the upper plate comprises a first through-hole and a second through-hole aligned to the first image sensor and the second image sensor, respectively;
a first lens assembly comprising a first lens system and a first barrel accommodating the first lens system, and assembled to the first through-hole to be aligned with the first image sensor;
a second lens assembly comprising a second lens system and a second barrel accommodating the second lens system, and assembled to the second through-hole to be aligned with the second image sensor; and
a filter attached to the lens holder and disposed between at least the first image sensor and the first lens assembly and between at least the second image sensor and the second lens assembly,
wherein the first barrel comprises a first sidewall coupled to the first through-hole and a second sidewall having a greater diameter than the first sidewall and located between the first through-hole and the first image sensor, and the second barrel comprises a third sidewall coupled to the second through-hole and a fourth sidewall having a greater diameter than the third sidewall and located between the second through-hole and the second image sensor.
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