US 11,688,988 B2
Electronic device, inlet unit and welding method
Takumi Ide, Kanagawa (JP); Akira Tatsuzue, Saitama (JP); Hiroshi Fuse, Tokyo (JP); Masamichi Iida, Kanagawa (JP); Junji Suzuki, Shizuoka (JP); Takahiro Yoneyama, Tokyo (JP); and Toshiro Sonoda, Ibaraki (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 26, 2021, as Appl. No. 17/240,850.
Claims priority of application No. 2020-081432 (JP), filed on May 1, 2020; application No. 2020-081433 (JP), filed on May 1, 2020; application No. 2020-105971 (JP), filed on Jun. 19, 2020; application No. 2020-105972 (JP), filed on Jun. 19, 2020; and application No. 2021-003570 (JP), filed on Jan. 13, 2021.
Prior Publication US 2021/0344154 A1, Nov. 4, 2021
Int. Cl. H01R 3/00 (2006.01); H01R 43/02 (2006.01); B23K 11/11 (2006.01); B23K 11/00 (2006.01); H01R 43/16 (2006.01); H01R 13/04 (2006.01); B23K 101/38 (2006.01); H01R 105/00 (2006.01)
CPC H01R 43/02 (2013.01) [B23K 11/002 (2013.01); B23K 11/115 (2013.01); H01R 13/04 (2013.01); H01R 43/16 (2013.01); B23K 2101/38 (2018.08); H01R 2105/00 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic device comprising:
an inlet including a ground terminal having a first surface and a second surface opposite from the first surface;
a first casing metal plate configured to hold said inlet and contacting the first surface of said ground terminal; and
a second casing metal plate contacting the second surface of said ground terminal.