US 11,688,945 B2
Method of eliminating resonances in multiband radiating arrays
Martin Lee Zimmerman, Chicago, IL (US); and Peter J. Bisiules, LaGrange Park, IL (US)
Assigned to CommScope Technologies LLC, Hickory, NC (US)
Filed by CommScope Technologies LLC, Hickory, NC (US)
Filed on Apr. 15, 2021, as Appl. No. 17/231,112.
Application 17/231,112 is a continuation of application No. 16/508,355, filed on Jul. 11, 2019.
Application 16/508,355 is a continuation of application No. 15/792,917, filed on Oct. 25, 2017, granted, now 10,403,978, issued on Sep. 3, 2019.
Application 15/792,917 is a continuation of application No. 14/683,424, filed on Apr. 10, 2015, granted, now 9,819,084, issued on Nov. 14, 2017.
Claims priority of provisional application 61/978,791, filed on Apr. 11, 2014.
Prior Publication US 2021/0234275 A1, Jul. 29, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 5/48 (2015.01); H01Q 1/24 (2006.01); H01Q 1/50 (2006.01); H01Q 5/42 (2015.01); H01Q 5/50 (2015.01); H01Q 9/18 (2006.01); H01Q 21/26 (2006.01)
CPC H01Q 5/48 (2015.01) [H01Q 1/24 (2013.01); H01Q 1/246 (2013.01); H01Q 1/50 (2013.01); H01Q 5/42 (2015.01); H01Q 5/50 (2015.01); H01Q 9/18 (2013.01); H01Q 21/26 (2013.01)] 20 Claims
OG exemplary drawing
 
8. A radiating element, comprising:
first and second dipole arms, the first dipole arm and the second dipole arm each having a respective capacitive coupling area; and
a first multilayer feedboard having a first metallization layer that includes a first feed line and a second metallization layer that includes a first balun, first through fourth capacitive elements and first and second inductors,
wherein the first and second dipole arms are supported on the multilayer feedboard, and
wherein the second capacitive element and the capacitive coupling area of the first dipole arm form a first capacitor, and the fourth capacitive element and the capacitive coupling area of the second dipole arm form a second capacitor.