US 11,688,832 B2
Light-altering material arrangements for light-emitting devices
Tucker McFarlane, Morrisville, NC (US); Matthew Brady, Raleigh, NC (US); Derek Miller, Raleigh, NC (US); and Colin Blakely, Raleigh, NC (US)
Assigned to CreeLED, Inc., Durham, NC (US)
Filed by CreeLED, Inc., Durham, NC (US)
Filed on Apr. 16, 2020, as Appl. No. 16/850,540.
Prior Publication US 2021/0328112 A1, Oct. 21, 2021
Int. Cl. H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01)
CPC H01L 33/502 (2013.01) [H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) device comprising:
at least one LED chip comprising a top face, a bottom face, and peripheral sidewalls that bound the top face and the bottom face;
a wavelength conversion element arranged on the top face of the at least one LED chip, the wavelength conversion element comprising at least one lumiphoric material; and
a light-altering material arranged on the peripheral sidewalls of the at least one LED chip, the light-altering material comprising a width as measured from the peripheral sidewalls that is in a range from 15 microns (μm) to 100 μm, wherein the light-altering material is further arranged to extend from the peripheral sidewalls of the at least one LED chip along peripheral side surfaces of the wavelength conversion element to a position that is adjacent a top face of the wavelength conversion element, wherein the top face of the at least one LED chip is devoid of the light-altering material.