CPC H01L 33/502 (2013.01) [H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01)] | 24 Claims |
1. A light-emitting diode (LED) device comprising:
at least one LED chip comprising a top face, a bottom face, and peripheral sidewalls that bound the top face and the bottom face;
a wavelength conversion element arranged on the top face of the at least one LED chip, the wavelength conversion element comprising at least one lumiphoric material; and
a light-altering material arranged on the peripheral sidewalls of the at least one LED chip, the light-altering material comprising a width as measured from the peripheral sidewalls that is in a range from 15 microns (μm) to 100 μm, wherein the light-altering material is further arranged to extend from the peripheral sidewalls of the at least one LED chip along peripheral side surfaces of the wavelength conversion element to a position that is adjacent a top face of the wavelength conversion element, wherein the top face of the at least one LED chip is devoid of the light-altering material.
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