US 11,688,725 B2
Semiconductor packages
Sheng-Chieh Yang, Hsinchu (TW); Ching-Hua Hsieh, Hsinchu (TW); Chih-Wei Lin, Hsinchu County (TW); and Yu-Hao Chen, HsinChu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 18, 2022, as Appl. No. 17/578,372.
Application 17/578,372 is a continuation of application No. 16/866,561, filed on May 5, 2020, granted, now 11,233,039.
Claims priority of provisional application 62/893,774, filed on Aug. 29, 2019.
Prior Publication US 2022/0139894 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/00 (2006.01); H01L 25/16 (2023.01); H01L 23/498 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 23/49822 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a photonic integrated circuit, comprising an optical coupler;
an electronic integrated circuit, disposed aside the photonic integrated circuit; and
a waveguide, optically coupled to the optical coupler, wherein the waveguide is disposed at an edge of the photonic integrated circuit and protrudes from the edge of the photonic integrated circuit.