CPC H01L 25/167 (2013.01) [H01L 23/49822 (2013.01)] | 20 Claims |
1. A semiconductor package, comprising:
a photonic integrated circuit, comprising an optical coupler;
an electronic integrated circuit, disposed aside the photonic integrated circuit; and
a waveguide, optically coupled to the optical coupler, wherein the waveguide is disposed at an edge of the photonic integrated circuit and protrudes from the edge of the photonic integrated circuit.
|