US 11,688,697 B2
Emi shielding for flip chip package with exposed die backside
Dong Won Son, Incheon si (KR); Byeonghoon Kim, Seoul (KR); Sung Ho Choi, Incheon si (KR); Sung Jae Lim, Incheon (KR); Jong Ho Shin, Gyenggi-do (KR); SungWon Cho, Seoul (KR); ChangOh Kim, Incheon (KR); and KyoungHee Park, Seoul (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on May 11, 2022, as Appl. No. 17/662,977.
Application 17/662,977 is a continuation of application No. 17/068,482, filed on Oct. 12, 2020, granted, now 11,355,452.
Application 17/068,482 is a continuation in part of application No. 16/529,486, filed on Aug. 1, 2019, granted, now 10,804,217, issued on Aug. 1, 2019.
Claims priority of provisional application 63/001,218, filed on Mar. 27, 2020.
Claims priority of provisional application 62/717,415, filed on Aug. 10, 2018.
Prior Publication US 2022/0270983 A1, Aug. 25, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/49816 (2013.01); H01L 23/562 (2013.01); H01L 24/14 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor die;
an encapsulant deposited around the semiconductor die;
a conductive layer formed over the encapsulant and semiconductor die;
a solder paste disposed over the conductive layer; and
a heat spreader disposed over the solder paste.