CPC H01L 23/552 (2013.01) [H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/49816 (2013.01); H01L 23/562 (2013.01); H01L 24/14 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01)] | 21 Claims |
1. A semiconductor device, comprising:
a semiconductor die;
an encapsulant deposited around the semiconductor die;
a conductive layer formed over the encapsulant and semiconductor die;
a solder paste disposed over the conductive layer; and
a heat spreader disposed over the solder paste.
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