US 11,688,677 B2
Continuous interconnects between heterogeneous materials
Mark William Ronay, Portland, OR (US); Jorge E. Carbo, Jr., Portland, OR (US); Trevor Antonio Rivera, Portland, OR (US); Charles J. Kinzel, Portland, OR (US); Michael Adventure Hopkins, Portland, OR (US); and Sai Srinivas Desabathina, Beaverton, OR (US)
Assigned to Liquid Wire Inc., Portland, OR (US)
Filed by Liquid Wire Inc., Portland, OR (US)
Filed on May 18, 2021, as Appl. No. 17/303,030.
Application 17/303,030 is a continuation of application No. 16/885,854, filed on May 28, 2020.
Claims priority of provisional application 62/853,481, filed on May 28, 2019.
Prior Publication US 2021/0272891 A1, Sep. 2, 2021
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49833 (2013.01) [H01L 21/485 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 23/4985 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A deformable electronic device, comprising:
a first substrate portion comprising a metal clad layer;
at least one surface mount component mounted to the first substrate portion and electrically coupled with the metal clad layer;
a second substrate portion, attached to the first substrate portion, including at least one trace formed thereon with conductive gel; and
a via, comprised of conductive metal gel extending between and electrically coupling the metal clad layer with the trace.