CPC H01L 23/49833 (2013.01) [H01L 21/485 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 23/4985 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01)] | 10 Claims |
1. A deformable electronic device, comprising:
a first substrate portion comprising a metal clad layer;
at least one surface mount component mounted to the first substrate portion and electrically coupled with the metal clad layer;
a second substrate portion, attached to the first substrate portion, including at least one trace formed thereon with conductive gel; and
a via, comprised of conductive metal gel extending between and electrically coupling the metal clad layer with the trace.
|