US 11,688,591 B2
Physical vapor deposition apparatus and method thereof
Chia-Hsi Wang, Changhua County (TW); Kun-Che Ho, Taipei (TW); and Yen-Yu Chen, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Jul. 28, 2022, as Appl. No. 17/876,489.
Application 17/876,489 is a division of application No. 16/572,186, filed on Sep. 16, 2019, granted, now 11,462,394.
Claims priority of provisional application 62/738,725, filed on Sep. 28, 2018.
Prior Publication US 2022/0367161 A1, Nov. 17, 2022
Int. Cl. H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/35 (2006.01); H01L 21/02 (2006.01)
CPC H01J 37/3455 (2013.01) [C23C 14/3407 (2013.01); C23C 14/3442 (2013.01); C23C 14/351 (2013.01); H01J 37/3405 (2013.01); H01J 37/3414 (2013.01); H01J 37/3435 (2013.01); H01J 37/3452 (2013.01); H01J 37/3461 (2013.01); H01L 21/02631 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a processing chamber configured to house a workpiece;
a target holder in the processing chamber;
a first magnetic element over a backside of the target holder;
a first arm assembly connected to the first magnetic element;
a rotational shaft; and
a first hinge mechanism connecting the rotational shaft and the first arm assembly, wherein the first arm assembly comprises a first prong and a second prong at opposite sides of the first hinge mechanism; and
a controller programmed to control motion of the first arm assembly in such a way that the first prong revolves in an orbit motion path about the first hinge mechanism while the second prong remains stationary.