CPC H01F 38/14 (2013.01) [H01F 3/14 (2013.01); H01F 5/003 (2013.01); H01F 5/04 (2013.01); H01F 7/20 (2013.01); H04B 3/548 (2013.01); H01F 27/06 (2013.01); H01F 2007/062 (2013.01); H04B 2203/5454 (2013.01); H04B 2203/5483 (2013.01)] | 20 Claims |
1. A backplane comprising:
a substrate defining a plurality of apertures therethrough;
a plurality of electromagnetic connectors at the apertures of the substrate, each one of the plurality of electromagnetic connectors configured to form a first magnetic circuit portion, each electromagnetic connector configured to mate with a second electromagnetic connector of a pluggable module to couple the pluggable module with the backplane, the second electromagnetic connector configured to form a second magnetic circuit portion, the first magnetic circuit portion and the second magnetic circuit portion configured to form a magnetic circuit when the electromagnetic connector is mated with the second electromagnetic connector and maintain isolation between the pluggable module and the backplane.
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