CPC G06F 30/398 (2020.01) [G06F 2111/20 (2020.01); G06F 2119/08 (2020.01); G06F 2119/10 (2020.01); H01L 29/785 (2013.01)] | 20 Claims |
1. A method for evaluating a heat sensitive structure comprising:
identifying a first heat generating structure in an integrated circuit design layout, the first heat generating structure having a nominal operating temperature and a first thermal coupling volume;
identifying a heat sensitive structure within the first thermal coupling volume having a nominal operating temperature Tnom;
calculating a nominal operating temperature increase ΔTh1 for the heat sensitive structure induced by thermal coupling between the first heat generating structure and the heat sensitive structure; and
evaluating a functional parameter of the heat sensitive structure at an evaluation temperature TE=Tnom+ΔTh1.
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