US 11,686,765 B2
Die extraction method
Kun Wang, Hefei (CN)
Assigned to CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed by CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed on Nov. 22, 2021, as Appl. No. 17/455,973.
Application 17/455,973 is a continuation of application No. PCT/CN2021/106332, filed on Jul. 14, 2021.
Claims priority of application No. 202011145942.0 (CN), filed on Oct. 23, 2020.
Prior Publication US 2022/0128627 A1, Apr. 28, 2022
Int. Cl. G01R 31/28 (2006.01); G01N 1/32 (2006.01)
CPC G01R 31/2898 (2013.01) [G01N 1/32 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A die extraction method for extracting a target die from multiple die layers in an integrated circuit sample, the method comprising the following steps:
removing solder balls from a back side of the integrated circuit sample;
attaching the back side of the integrated circuit sample to a polishing jig, and flattening the integrated circuit sample and the polishing jig by a flattener;
polishing a front side of the integrated circuit sample to remove a part on a front side of the target die, and retain a part of a die attach film (DAF) layer on the front side of the target die and a bonding wire located in the part;
attaching the front side of the integrated circuit sample to the polishing jig and flattening the integrated circuit sample and the polishing jig by the flattener;
polishing the back side of the integrated circuit sample to remove a part on a back side of the target die, and retain a DAF layer on the back side of the target die;
removing the DAF and a packaging material remaining on the integrated circuit sample to obtain the target die; and
attaching the back side of the target die to a glass slide, thus completing extraction of the target die.