US 11,686,690 B2
System and method for inspection and metrology of four sides of semiconductor devices
Bert Vangilbergen, Tienen (BE); Harry Paredaens, Erps-Kwerps (BE); Maarten Brocatus, Milpitas, CA (US); and Foon Ming Chan, Hong Kong (HK)
Assigned to KLA Corporation, Milpitas, CA (US)
Filed by KLA Corporation, Milpitas, CA (US)
Filed on May 25, 2021, as Appl. No. 17/330,220.
Claims priority of provisional application 63/112,650, filed on Nov. 12, 2020.
Prior Publication US 2022/0146438 A1, May 12, 2022
Int. Cl. G01N 21/95 (2006.01); G01N 21/88 (2006.01); H01L 21/66 (2006.01)
CPC G01N 21/9503 (2013.01) [G01N 21/8806 (2013.01); H01L 22/12 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A characterization system, comprising:
a sample carrier;
a stage assembly including a pick-and-place head;
an imaging subsystem including a first channel and a second channel, wherein the stage assembly is configured to transfer a sample between the carrier and the imaging subsystem; and
a controller including one or more processors and memory, the one or more processors configured to execute a set of program instructions stored in the memory, the set of program instructions configured to cause the one or more processors to:
direct the stage assembly to move the sample from the carrier located at a first position to the imaging subsystem;
direct the imaging subsystem to inspect a first side of the sample via the first channel of the imaging subsystem and a second side of the sample via the second channel of the imaging subsystem;
direct the stage assembly to move the sample from the imaging subsystem to the carrier;
direct the carrier to move to a second position;
direct the carrier to rotate by 90 degrees relative to an orientation of the carrier in the first position;
direct the stage assembly to move the sample from the carrier located at the second position to the imaging subsystem; and
direct the imaging subsystem to inspect a third side of the sample via the first channel of the imaging subsystem and a fourth side of the sample via the second channel of the imaging subsystem; and
combine one or more images of each of the first side, the second side, the third side, and the fourth side of the sample.