US 11,686,648 B2
Electrical test of optical components via metal-insulator-semiconductor capacitor structures
Xunyuan Zhang, Mechanicsburg, PA (US); Ravi S. Tummidi, Breinigsville, PA (US); Tony P. Polous, San Jose, CA (US); and Mark A. Webster, Bethlehem, PA (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Jul. 23, 2021, as Appl. No. 17/443,280.
Prior Publication US 2023/0022612 A1, Jan. 26, 2023
Int. Cl. G01M 11/00 (2006.01); G02B 6/12 (2006.01)
CPC G01M 11/30 (2013.01) [G02B 6/12007 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12145 (2013.01); G02B 2006/12164 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, including:
a plurality of optical devices including a first material embedded in a second material, wherein each optical device of the plurality of optical devices is associated with a different thickness range of a plurality of thickness ranges for the first material, and wherein the first material comprises a semiconductor material;
a first capacitance measurement point including the first material embedded in the second material; and
a second capacitance measurement point including a region from which the first material has been replaced with the second material.