CPC G01H 1/003 (2013.01) [G01D 21/02 (2013.01); G01K 13/08 (2013.01); G01M 13/045 (2013.01); H02K 11/25 (2016.01)] | 23 Claims |
1. A condition monitoring device for monitoring machinery or equipment, comprising:
a combination of on-board sensors that include
a non-contacting temperature sensing module configured to receive control signaling and provide a non-contacting temperature sensing signal containing information about a temperature of the machinery or equipment without direct surface contact between the non-contacting temperature sensing module and the machinery or equipment,
a magnet flux sensing module configured to receive the control signaling and provide a magnet flux sensing signal containing information about magnet flux sensed from the machinery or equipment, and
a 3-axis vibration measurement module configured to receive the control signaling and provide a 3-axis vibration measurement sensing signal containing information about a 3-axis vibration measurement of the machinery or equipment; and
a condition monitoring module configured to
provide the control signaling to the combination of on-board sensors,
receive a baseline operating condition signal containing information about a baseline operating condition of the machinery or equipment,
receive the non-contacting temperature sensing signal, the magnet flux sensing signal, and the 3-axis vibration measurement sensing signal from the combination of on-board sensors, and
provide a condition monitoring signal containing information about an operating condition of the machinery or equipment, based upon a data synthesis condition monitoring technique that synthesizes non-contact temperature sensing, magnetic flux and 3-axis vibration data received from the combination of on-board sensors, determines a current operating condition of the machinery or equipment, and compares the current operating condition and the baseline operating condition of the machinery or equipment to determine the operating condition;
wherein the condition monitoring device comprises a printed circuit board assembly having the combination of on-board sensors and the condition monitoring module all configured thereon.
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