US 11,686,008 B2
Electroplating apparatus and electroplating method
Heng-Ming Nien, Taoyuan (TW); Chih-Chiang Lu, New Taipei (TW); Cho-Ying Wu, Taoyuan (TW); and Shih-Lian Cheng, New Taipei (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on May 16, 2022, as Appl. No. 17/745,809.
Claims priority of provisional application 63/255,438, filed on Oct. 14, 2021.
Claims priority of application No. 111113003 (TW), filed on Apr. 6, 2022.
Prior Publication US 2023/0124732 A1, Apr. 20, 2023
Int. Cl. C25D 5/00 (2006.01); C25D 17/00 (2006.01)
CPC C25D 5/007 (2020.08) [C25D 17/007 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electroplating apparatus, comprising:
an anode and a cathode;
a power supply, electrically connected to the anode and the cathode; and
a regulating plate, arranged between the anode and the cathode, wherein the regulating plate comprises an insulating grid plate and a plurality of magnetic components, and the plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate.