US 11,685,649 B2
Capping plate for panel scale packaging of MEMS products
John Hong, San Diego, CA (US); Tallis Chang, San Diego, CA (US); Edward Chan, San Diego, CA (US); Bing Wen, San Diego, CA (US); Yaoling Pan, San Diego, CA (US); and Kenji Nomura, San Diego, CA (US)
Assigned to Obsidian Sensors, Inc., San Diego, CA (US)
Appl. No. 16/982,519
Filed by Obsidian Sensors, Inc., San Diego, CA (US)
PCT Filed Mar. 20, 2019, PCT No. PCT/US2019/023227
§ 371(c)(1), (2) Date Sep. 18, 2020,
PCT Pub. No. WO2019/183259, PCT Pub. Date Sep. 26, 2019.
Claims priority of provisional application 62/645,687, filed on Mar. 20, 2018.
Prior Publication US 2021/0002130 A1, Jan. 7, 2021
Int. Cl. B81C 1/00 (2006.01); B81B 7/00 (2006.01); G01J 5/20 (2006.01)
CPC B81C 1/00269 (2013.01) [B81B 7/0038 (2013.01); B81C 1/00285 (2013.01); B81C 2203/019 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/035 (2013.01); B81C 2203/05 (2013.01); G01J 5/20 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of manufacturing microelectromechanical systems (“MEMS”) products comprising:
providing glass spacers;
depositing an anti-reflective coating on the glass spacers;
coupling a wavelength-specific transmissive window to the anti-reflective coating;
providing a window plate;
attaching the window plate to the glass spacers;
aligning the glass spacers with a MEMS device glass plate;
bonding the glass spacers to the MEMS device glass plate; and
singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS products.