US 11,685,015 B2
Method and system for performing chemical mechanical polishing
Chih-Yuan Yang, Hsinchu (TW); Huai-Tei Yang, Hsinchu (TW); Yu-Chen Wei, New Taipei (TW); Szu-Cheng Wang, Tainan (TW); Li-Hsiang Chao, New Taipei (TW); Jen-Chieh Lai, Tainan (TW); and Shih-Ho Lin, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Jan. 28, 2019, as Appl. No. 16/259,856.
Prior Publication US 2020/0238473 A1, Jul. 30, 2020
Int. Cl. B24B 37/32 (2012.01); B24B 37/10 (2012.01); H01L 21/8234 (2006.01); H01L 21/304 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/321 (2006.01)
CPC B24B 37/32 (2013.01) [B24B 37/10 (2013.01); H01L 21/304 (2013.01); H01L 21/3212 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
securing a wafer in a carrier head, the carrier head comprising:
a housing enclosing the wafer, wherein the housing includes a retainer ring recess; and
a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, wherein the retainer ring includes a main body portion and a bottom portion connected to the main body portion, a bottom surface of the bottom portion comprises at least one first engraved region and a first non-engraved region adjacent to the first engraved region, and the at least one first engraved region and the first non-engraved region are at the same level height;
pressing the wafer against a polishing pad;
moving the carrier head or the polishing pad relative to the other;
providing a slurry to the polishing pad, the slurry including abrasive particles and a chemical solution;
conditioning the polishing pad using a conditioning disk; and
applying a first vacuum suction force over the polishing pad for collecting the abrasive particles through at least one first vacuum hole disposed on a second non-engraved region of a bottom surface of the conditioning disk.