CPC B24B 37/32 (2013.01) [B24B 37/10 (2013.01); H01L 21/304 (2013.01); H01L 21/3212 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01)] | 20 Claims |
1. A method, comprising:
securing a wafer in a carrier head, the carrier head comprising:
a housing enclosing the wafer, wherein the housing includes a retainer ring recess; and
a retainer ring positioned in the retainer ring recess, the retainer ring surrounding the wafer, wherein the retainer ring includes a main body portion and a bottom portion connected to the main body portion, a bottom surface of the bottom portion comprises at least one first engraved region and a first non-engraved region adjacent to the first engraved region, and the at least one first engraved region and the first non-engraved region are at the same level height;
pressing the wafer against a polishing pad;
moving the carrier head or the polishing pad relative to the other;
providing a slurry to the polishing pad, the slurry including abrasive particles and a chemical solution;
conditioning the polishing pad using a conditioning disk; and
applying a first vacuum suction force over the polishing pad for collecting the abrasive particles through at least one first vacuum hole disposed on a second non-engraved region of a bottom surface of the conditioning disk.
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