US 11,685,014 B2
Formulations for advanced polishing pads
Sivapackia Ganapathiappan, Los Altos, CA (US); Ankit Vora, Bothell, WA (US); Boyi Fu, San Jose, CA (US); Venkat Hariharan, Lehi, UT (US); Mayu Yamamura, San Mateo, CA (US); Mario Cornejo, San Jose, CA (US); Igor Abramson, Cupertino, CA (US); Mo Yang, Sunnyvale, CA (US); Daniel Redfield, Morgan Hill, CA (US); Rajeev Bajaj, Fremont, CA (US); and Nag B. Patibandla, Pleasanton, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 2, 2019, as Appl. No. 16/529,884.
Claims priority of provisional application 62/726,661, filed on Sep. 4, 2018.
Prior Publication US 2020/0070302 A1, Mar. 5, 2020
Int. Cl. B24B 37/24 (2012.01); C08F 283/00 (2006.01); B33Y 10/00 (2015.01); B29C 64/112 (2017.01); B33Y 70/10 (2020.01); B29L 31/00 (2006.01); B33Y 80/00 (2015.01)
CPC B24B 37/24 (2013.01) [B29C 64/112 (2017.08); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); C08F 283/008 (2013.01); B29L 2031/736 (2013.01); B33Y 80/00 (2014.12)] 19 Claims
OG exemplary drawing
 
1. A method of forming a polishing article, comprising:
depositing a plurality of composite layers with an additive manufacturing system to reach a target thickness, wherein depositing the plurality of composite layers comprises:
dispensing one or more droplets of a curable resin precursor composition onto a support, the curable resin precursor composition comprising:
a first resin precursor component that comprises a radiation curable semi-crystalline aliphatic polycarbonate urethane acrylate oligomer;
a second resin precursor component that comprises an acrylate monomer mixture, comprising:
a monofunctional acrylate monomer selected from isobornyl acrylate, 3,3,5-trimethylcyclohexyl acrylate, tetrahydrofurfuryl acrylate, or combinations thereof; and
a multifunctional acrylate monomer selected from dipropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,3-butanediol diacrylate, or combinations thereof, wherein the acrylate monomer mixture is present from 70% to 80% by weight based on a total weight of the curable resin precursor composition; and
a photoinitiator present from 0.5% to 2.5% based on the total weight of the curable resin precursor composition,
wherein the curable resin precursor composition has a viscosity within a range from about 10 cP to about 30 cP at 70 degrees Celsius that enables the curable resin precursor composition to be dispensed to form a portion of the polishing article by the additive manufacturing system.