US 11,684,981 B2
Ultra-fine nanocrystalline diamond precision cutting tool and manufacturing method therefor
Nan Jiang, Zhejiang (CN); He Li, Zhejiang (CN); Bo Wang, Zhejiang (CN); Jian Yi, Zhejiang (CN); and Yang Cao, Zhejiang (CN)
Assigned to NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING. CHINESE ACADEMY OF SCIENCES, Zhejiang (CN)
Appl. No. 17/43,439
Filed by NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES, Zhejiang (CN)
PCT Filed Apr. 18, 2018, PCT No. PCT/CN2018/083522
§ 371(c)(1), (2) Date Sep. 29, 2020,
PCT Pub. No. WO2019/184018, PCT Pub. Date Oct. 3, 2019.
Claims priority of application No. 201810272430.7 (CN), filed on Mar. 29, 2018.
Prior Publication US 2021/0016364 A1, Jan. 21, 2021
Int. Cl. B23B 27/20 (2006.01); C23C 16/02 (2006.01); C23C 16/27 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01)
CPC B23B 27/20 (2013.01) [C23C 16/02 (2013.01); C23C 16/271 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); Y10T 428/30 (2015.01)] 13 Claims
OG exemplary drawing
 
1. An ultra-fine nanocrystalline diamond cutting tool, which is composed of a handle and a diamond cutter, wherein the diamond cutter is made of a self-supporting ultra-fine nanocrystalline diamond thick film;
wherein which the thick film has a thickness of 100-3000 μm and has a diamond grain size of 1 nm-20 nm;
wherein, the surface of the thick film is smooth;
wherein, the ultra-fine nanocrystalline diamond cutting tool is prepared through the following steps:
(i) growing an ultra-fine nanocrystalline diamond layer with a thickness of 5 to 200 μm on a surface of a silicon wafer by direct current hot cathode glow discharge chemical vapor deposition;
(ii) growing ultra-fine nanocrystalline diamond on the ultra-fine nanocrystalline diamond layer by hot filament chemical vapor deposition to obtain an ultra-fine nanocrystalline diamond thick film;
(iii) separating the ultra-fine nanocrystalline diamond thick film from the silicon wafer, thereby obtaining the self-supporting ultra-fine nanocrystalline diamond thick film;
(iv) cutting the self-supporting ultra-fine nanocrystalline diamond thick film into a blade shape, welding it to the handle, and then edging, coarsely grinding, and finely grinding, thereby obtaining the ultra-fine nanocrystalline diamond cutting tool.