US 11,684,253 B2
2D multi-layer thickness measurement with reconstructed spectrum
Zaixing Mao, Tokyo (JP); Zhenguo Wang, Ridgewood, NJ (US); Bin Cao, Wayne, NJ (US); and Kinpui Chan, Ridgewood, NJ (US)
Assigned to TOPCON CORPORATION, Tokyo (JP)
Filed by TOPCON CORPORATION, Tokyo (JP)
Filed on Apr. 22, 2020, as Appl. No. 16/855,393.
Claims priority of provisional application 62/837,785, filed on Apr. 24, 2019.
Prior Publication US 2020/0337553 A1, Oct. 29, 2020
Int. Cl. G01J 3/45 (2006.01); A61B 3/10 (2006.01); A61B 3/00 (2006.01); A61B 3/14 (2006.01); G01B 9/02 (2022.01); G01B 11/06 (2006.01)
CPC A61B 3/101 (2013.01) [A61B 3/0025 (2013.01); A61B 3/14 (2013.01); G01B 9/02041 (2013.01); G01B 9/02083 (2013.01); G01B 11/06 (2013.01); G01J 3/45 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for measuring layer thickness of a structure comprising:
acquiring a multi-spectral interference pattern of the structure;
performing a hyperspectral reconstruction on the multi-spectral interference pattern, thereby generating a reconstructed full- or hyper-spectral interference pattern; and
estimating the layer thickness based on the reconstructed full- or hyper-spectral interference pattern.