US 11,683,890 B2
Reflow grid array to support late attach of components
Jonathan W. Thibado, Beaverton, OR (US); Jeffory L. Smalley, Olympia, WA (US); John C. Gulick, Portland, OR (US); Phi Thanh, Hillsboro, OR (US); and Mohanraj Prabhugoud, Hillsboro, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Dec. 20, 2018, as Appl. No. 16/227,243.
Prior Publication US 2020/0205299 A1, Jun. 25, 2020
Int. Cl. H05K 3/34 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); G06F 1/16 (2006.01); H01L 23/498 (2006.01)
CPC H05K 3/3494 (2013.01) [G06F 1/16 (2013.01); H01L 23/49816 (2013.01); H05K 1/0201 (2013.01); H05K 1/0212 (2013.01); H05K 1/112 (2013.01); H05K 1/181 (2013.01); H05K 3/3421 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A computer system comprising:
a motherboard (MB);
a reflowable grid array (RGA) interposer including first connection pads in contact with one or more contacts of the MB, second connection pads on an opposite side of the RGA interposer as the first connection pads, and heating elements to heat the second connection pads;
a central processing unit (CPU) in contact with a first set of the second connection pads; and a companion component in contact with a second set of the second connection pads, wherein the heating elements are further to attach and/or detach the CPU and the companion component to and/or from the respective first and second sets of the second connection pads in any order after the first connection pads are attached to the MB, wherein the second set of the second connection pads to which the companion component is in contact are not connected within the RGA interposer to the first connection pads.