US 11,683,884 B2
Component carrier with embedded component connected in cavity by anchored first and second polymers
Imane Souli, Leoben (AT); Erich Preiner, St. Michael in Obersteiermark (AT); Martin Schrei, Mogersdorf (AT); and Vanesa López Blanco, Vimianzo (ES)
Assigned to AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Jun. 21, 2021, as Appl. No. 17/304,458.
Claims priority of application No. 20181479 (EP), filed on Jun. 22, 2020.
Prior Publication US 2021/0400808 A1, Dec. 23, 2021
Int. Cl. H05K 1/03 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0313 (2013.01) [H05K 1/185 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A component carrier, comprising:
a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer; and
a component embedded in the cavity of the stack and being at least partially covered by a second polymer;
wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other, forming a transition region between one of said polymers and the other one of the polymers, in which polymer molecules of the two types are mutually anchored with each other by mechanically interlocking.