CPC H05K 1/0313 (2013.01) [H05K 1/185 (2013.01)] | 15 Claims |
1. A component carrier, comprising:
a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer; and
a component embedded in the cavity of the stack and being at least partially covered by a second polymer;
wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other, forming a transition region between one of said polymers and the other one of the polymers, in which polymer molecules of the two types are mutually anchored with each other by mechanically interlocking.
|