CPC H01L 27/0207 (2013.01) [H01L 23/5286 (2013.01); H01L 27/11803 (2013.01); G06F 30/394 (2020.01)] | 25 Claims |
1. An integrated circuit structure, comprising:
a cell on a metal level, the cell defined by a cell boundary;
a plurality of substantially parallel interconnect lines inside the cell boundary, wherein the plurality of substantially parallel interconnect lines comprise one or more signal tracks; and
a first power track and a second power track both dedicated to power and located completely inside the cell boundary without any power tracks along the cell boundary on the metal level, wherein the first and second power tracks are outermost ones of the plurality of substantially parallel interconnect lines, and wherein the one or more signal tracks are between the first and second power tracks without an additional power track intervening between the first and second power tracks.
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