CPC H01L 23/562 (2013.01) [H01L 23/3185 (2013.01); H01L 23/367 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/351 (2013.01)] | 20 Claims |
1. A semiconductor package, comprising:
a base film having a first surface and a second surface opposite to the first surface;
a plurality of input/output lines on the first surface of the base film;
a semiconductor chip disposed on the first surface of the base film and connected to the input/output lines, the semiconductor chip including a central portion and end portions on opposite sides of the central portion and including a plurality of chip pads at a surface of the semiconductor chip, each chip pad connected to a bump or ball such that each chip pad is between the bump or ball and a portion of the semiconductor chip; and
a heat radiation pattern on the second surface of the base film, the heat radiation pattern corresponding to the semiconductor chip and having a plurality of openings that correspond to the end portions of the semiconductor chip and that vertically overlap the end portions of the semiconductor chip and also vertically overlap the plurality of chip pads.
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