US 11,682,633 B2
Semiconductor package
Ji-Yong Park, Hwaseong-si (KR); and Duckgyu Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 22, 2021, as Appl. No. 17/181,617.
Claims priority of application No. 10-2020-0086278 (KR), filed on Jul. 13, 2020.
Prior Publication US 2022/0013476 A1, Jan. 13, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 23/3185 (2013.01); H01L 23/367 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/351 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a base film having a first surface and a second surface opposite to the first surface;
a plurality of input/output lines on the first surface of the base film;
a semiconductor chip disposed on the first surface of the base film and connected to the input/output lines, the semiconductor chip including a central portion and end portions on opposite sides of the central portion and including a plurality of chip pads at a surface of the semiconductor chip, each chip pad connected to a bump or ball such that each chip pad is between the bump or ball and a portion of the semiconductor chip; and
a heat radiation pattern on the second surface of the base film, the heat radiation pattern corresponding to the semiconductor chip and having a plurality of openings that correspond to the end portions of the semiconductor chip and that vertically overlap the end portions of the semiconductor chip and also vertically overlap the plurality of chip pads.