US 11,682,598 B2
Sensor package and manufacturing method thereof
Ji Young Chung, Seongnam-si (KR); Dong Joo Park, Incheon (KR); Jin Seong Kim, Goyang-si (KR); Jae Sung Park, Paju-si (KR); and Se Hwan Hong, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Nov. 16, 2021, as Appl. No. 17/527,767.
Application 17/527,767 is a continuation of application No. 16/890,027, filed on Jun. 2, 2020, granted, now 11,177,187.
Application 16/890,027 is a continuation of application No. 15/988,940, filed on May 24, 2018, granted, now 10,672,676, issued on Jun. 2, 2020.
Application 15/988,940 is a continuation of application No. 15/670,589, filed on Aug. 7, 2017, granted, now 9,984,947, issued on May 29, 2018.
Application 15/670,589 is a continuation of application No. 15/144,565, filed on May 2, 2016, granted, now 9,728,476, issued on Aug. 8, 2017.
Claims priority of application No. 10-2015-0079157 (KR), filed on Jun. 4, 2015.
Prior Publication US 2022/0077013 A1, Mar. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/15 (2006.01); H01L 23/00 (2006.01); G06V 40/13 (2022.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/15 (2013.01) [G06V 40/1329 (2022.01); H01L 24/48 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/4952 (2013.01); H01L 23/49805 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48165 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48992 (2013.01); H01L 2224/48997 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01)] 11 Claims
OG exemplary drawing
 
8. A method of manufacturing a sensor device, the method comprising:
receiving a first structure comprising:
a substrate having a top substrate side, a bottom substrate side, and a lateral substrate side, the substrate comprising a conductive layer on the top substrate side;
a semiconductor die comprising a top die side, a bottom die side coupled to the top substrate side, and a lateral die side, the semiconductor die comprising a sensing area on the top die side and a conductive pad on the top die side;
a conductive interconnection structure electrically connecting the conductive pad of the semiconductor die to the conductive layer of the substrate; and
an encapsulating material that covers the top substrate side and laterally surrounds the semiconductor die, the encapsulating material comprising a top encapsulating material side, a bottom encapsulating material side coupled to the top substrate side, and a lateral encapsulating material side; and
forming a sensor device comprising:
a dielectric layer (DL) comprising a top DL side, a bottom DL side coupled to the top encapsulating material side, and a lateral DL side; and
a plate positioned over the sensing area of the semiconductor die and over the conductive pad of the semiconductor die, the plate comprising a top plate side, a bottom plate side coupled to the top DL side, and a lateral plate side.