CPC H01L 22/34 (2013.01) [G01B 7/16 (2013.01); H01L 22/12 (2013.01); H01L 22/14 (2013.01)] | 20 Claims |
1. An integrated circuit comprising:
a first wafer comprising a first plurality of contact pads;
a second wafer comprising a second plurality of contact pads, wherein at least some of the first plurality of contact pads are bonded to at least some of the second plurality of contact pads forming a plurality of pillars;
a conductor positioned in the first and second wafers and parallel to and offset from at least some of the plurality of pillars; and
a continuity check circuit electrically coupled with the conductor and configured to detect warpage in the first and/or second wafers by detecting an interruption in conductivity of the conductor.
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