US 11,682,575 B2
Plasma processing apparatus, plasma processing method, and element chip manufacturing method
Atsushi Harikai, Osaka (JP); and Shogo Okita, Hyogo (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Dec. 9, 2020, as Appl. No. 17/116,008.
Claims priority of application No. JP2019-239420 (JP), filed on Dec. 27, 2019.
Prior Publication US 2021/0202289 A1, Jul. 1, 2021
Int. Cl. H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32715 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/6836 (2013.01); H01L 21/68742 (2013.01); H01L 21/78 (2013.01); H01J 2237/334 (2013.01); H01L 2221/68327 (2013.01)] 8 Claims
OG exemplary drawing
 
8. An element chip manufacturing method, comprising:
a preparation process of preparing a conveying carrier and a substrate, the conveying carrier including a holding sheet and a frame supporting an outer periphery of the holding sheet, the substrate being held on the holding sheet and segmented into a plurality of element regions and a plurality of dicing regions, and having a first principal surface and a second principal surface attached to the holding sheet; and
a plasma dicing process of exposing the substrate to an etching plasma, to remove the dicing regions from the substrate to dice the substrate into a plurality of element chips,
the plasma dicing process including:
an adsorption step of applying a voltage to an electrode part while the conveying carrier holding the substrate is on the stage, to allow the substrate to be adsorbed electrostatically to the stage;
an etching step of exposing the substrate adsorbed electrostatically to the stage to an etching plasma;
a frame separation step of lifting the support, to separate the frame away from the stage, with at least part of the holding sheet kept in contact with the stage;
a holding sheet separation step of applying to the electrode part a voltage that generates a repulsive force between the substrate and the electrode part, to separate the holding sheet away from the stage; and
a static elimination step of exposing the substrate separated away from the stage to a static elimination plasma.