CPC H01J 37/32862 (2013.01) [B08B 7/0035 (2013.01); H01J 37/32715 (2013.01)] | 19 Claims |
9. A semiconductor processing chamber cover plate comprising:
a flange extending about an exterior region of the cover plate, the flange defining a plurality of protrusions extending from a first surface of the flange; and
an upper wall vertically offset from the flange, wherein an interior volume is defined by the cover plate recessed from the first surface of the flange, wherein at least a portion of the flange extends radially outward from a peripheral edge of the upper wall.
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