US 11,682,527 B2
Multilayer capacitor
Jang Yeol Lee, Suwon-si (KR); Hye Min Bang, Suwon-si (KR); Tae Joon Park, Suwon-si (KR); and Hai Joon Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 4, 2021, as Appl. No. 17/307,388.
Claims priority of application No. 10-2020-0162565 (KR), filed on Nov. 27, 2020.
Prior Publication US 2022/0172898 A1, Jun. 2, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/248 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween;
external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer;
a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region; and
a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure,
wherein the first metal oxide layer and the second metal oxide layer directly contact to each other at end portions of each of the first metal oxide layer and the second metal oxide layer.