US 11,681,339 B2
Method of fabricating a circuit board and a display device including a circuit board
Byoungyong Kim, Seoul (KR); Seongtaek Lee, Suwon-si (KR); and Young-Min Park, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Mar. 3, 2022, as Appl. No. 17/685,735.
Application 17/685,735 is a continuation of application No. 17/064,661, filed on Oct. 7, 2020, granted, now 11,287,858.
Claims priority of application No. 10-2019-0126925 (KR), filed on Oct. 14, 2019.
Prior Publication US 2022/0187881 A1, Jun. 16, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G09G 3/20 (2006.01); G06F 1/18 (2006.01); H01L 27/32 (2006.01); G09G 3/3275 (2016.01); H01L 27/12 (2006.01); G06F 1/16 (2006.01)
CPC G06F 1/189 (2013.01) [G09G 3/3275 (2013.01); H01L 27/124 (2013.01); H01L 27/3276 (2013.01); G06F 1/1626 (2013.01); H01L 2227/323 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A display device, comprising:
a display panel including a signal pad; and
a circuit board comprising a connection pad including a first connection pad portion and a second connection pad portion,
wherein the connection pad is in contact with the signal pad; and
wherein a first surface roughness between the first connection pad portion and the signal pad is different from a second surface roughness between the second connection pad portion and the signal pad.