CPC G01R 33/0017 (2013.01) [G01R 33/0035 (2013.01); G01R 33/09 (2013.01)] | 19 Claims |
1. A magnetic sensor integrated circuit (IC) package, comprising:
a die;
sensor circuitry formed in a device layer of the die to generate an output signal for the sensor IC package;
an integrated coil to generate a magnetic field; and a magnetoresistive magnetic field sensing element on the die to detect changes in the magnetic field generated by the coil as a result of the presence of a ferromagnetic target,
wherein the sensor circuitry is configured to process the changes in the magnetic field generated by the coil, wherein the magnetoresistive magnetic field sensing element generates an output signal corresponding the detected changes in the magnetic field generated by the coil, and wherein the sensor circuitry is configured to receive the output signal from the magnetoresistive magnetic field sensing element and to process the output signal from the magnetoresistive magnetic field sensing element for generating the output signal for the sensor IC package,
wherein the sensor circuitry is configured to use less power for closer airgaps and more power for larger airgaps.
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