US 11,680,163 B2
Resin composition for optical waveguide cores, and dry film, optical waveguide core and photoelectric composite wiring board, each of which uses same
Junko Kurizoe, Osaka (JP); Naoyuki Kondou, Osaka (JP); Toru Nakashiba, Osaka (JP); and Shingo Maeda, Saga (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 16/755,284
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
PCT Filed Oct. 11, 2018, PCT No. PCT/JP2018/037842
§ 371(c)(1), (2) Date Apr. 10, 2020,
PCT Pub. No. WO2019/074035, PCT Pub. Date Apr. 18, 2019.
Claims priority of application No. JP2017-199544 (JP), filed on Oct. 13, 2017.
Prior Publication US 2021/0221999 A1, Jul. 22, 2021
Int. Cl. C08L 63/00 (2006.01); G02B 1/04 (2006.01); G02B 6/122 (2006.01)
CPC C08L 63/00 (2013.01) [G02B 1/046 (2013.01); G02B 6/1221 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A resin composition for optical waveguide cores, the resin composition comprising: liquid epoxy resin; and solid epoxy resin,
wherein a coefficient of variation calculated from a weighted average value of a refractive index of the liquid epoxy resin and a refractive index of the solid epoxy resin is 2.10% or less,
a ratio of the liquid epoxy resin to the entire resin composition is 5 to 23 mass %, and
a difference between an average refractive index of the liquid epoxy resin and an average refractive index of the entire resin composition is 0.04 or less.