US 11,679,557 B2
Processing machines and methods for heating a powder to produce three-dimensional components
Markus Pieger, Wendlingen am Neckar (DE); and Matthias Allenberg-Rabe, Stuttgart (DE)
Assigned to TRUMPF Laser- und Systemtechnik GmbH, Ditzingen (DE)
Filed by TRUMPF Laser- und Systemtechnik GmbH, Ditzingen (DE)
Filed on May 8, 2020, as Appl. No. 16/870,326.
Application 16/870,326 is a continuation of application No. PCT/EP2018/079389, filed on Oct. 26, 2018.
Claims priority of application No. 102017219982.2 (DE), filed on Nov. 9, 2017.
Prior Publication US 2020/0269500 A1, Aug. 27, 2020
Int. Cl. B29C 64/277 (2017.01); B33Y 10/00 (2015.01); B29C 64/153 (2017.01); B29C 64/255 (2017.01); B29C 64/295 (2017.01); B29C 64/393 (2017.01); B29C 64/268 (2017.01); B22F 12/42 (2021.01); B22F 12/44 (2021.01); B22F 12/45 (2021.01); B22F 12/49 (2021.01); B22F 12/90 (2021.01); B22F 10/47 (2021.01); B22F 10/36 (2021.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B22F 10/28 (2021.01)
CPC B29C 64/277 (2017.08) [B22F 10/36 (2021.01); B22F 10/47 (2021.01); B22F 12/42 (2021.01); B22F 12/44 (2021.01); B22F 12/45 (2021.01); B22F 12/49 (2021.01); B22F 12/90 (2021.01); B29C 64/153 (2017.08); B29C 64/255 (2017.08); B29C 64/268 (2017.08); B29C 64/295 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B22F 10/28 (2021.01); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12)] 17 Claims
OG exemplary drawing
 
1. A processing machine for producing three-dimensional components layer by layer by irradiating a powder by a processing beam, comprising:
a container with an opening and a moveable support for the powder;
an irradiating device comprising a processing beam scanner for aligning the processing beam on a processing field at the opening of the container for producing the three-dimensional component layer by layer by irradiating and melting the powder,
wherein the irradiating device further comprises a heater comprising:
a heating radiation source for generating a heating beam for heating the powder from above by aligning the heating beam on the processing field, wherein the heating radiation source is arranged and controlled to align a beam axis of the heating beam in stationary fashion on a point of the processing field irrespective of a position of the processing beam in the processing field; and
a beam shaping optical unit configured to convert a first beam profile of the heating beam into a second beam profile of the heating beam, wherein the beam shaping optical unit comprises at least one axicon for generating the second beam profile, wherein the second beam profile comprises a ring-shaped beam profile, and wherein a diameter of the ring-shaped beam profile of the heating beam in the processing plane substantially corresponds to a diameter of the processing field.