CPC B29C 33/3842 (2013.01) [B23K 20/02 (2013.01); B29K 2905/00 (2013.01)] | 8 Claims |
1. A manufacturing method of a hot forming mold including a cooling unit, the manufacturing method comprising:
a step of preparing a material by cutting a metal material to have a predetermined thickness to be divided into a plurality of divided materials;
a cooling channel processing step of processing cooling channels on a front surface and a rear surface within a contour line L by mold design information which is input in advance to an NC processor and cooling channel design information, on a surface on which the plurality of divided materials is overlaid;
a first insert step of interposing a first insert material along an outline of the cooling channel;
a second insert step of interposing a second insert material in the contour line L along the contour line L;
a temporary bonding step of heating the first insert material and the second insert material at a temperature at which the first insert material and the second insert material are melted to perform liquid phase diffusion bonding while maintaining a surface pressure of a bonded surface including the divided material and the first insert material and the second insert material after sequentially arranging the plurality of divided materials such that the cooling channels abut;
a step of testing the contour line L of the divided material which is temporarily bonded and the cooling channel by ultrasound scanning;
a solid phase diffusion bonding step of performing solid phase diffusion bonding after sequentially locating the plurality of divided materials such that the cooling channels abut to form an integrated material;
a mold material processing step of processing the integrated material along the contour line L by the mold design information which is input in advance through the NC processor to manufacture a mold material; and
a thermal processing step of heating the mold material at a predetermined temperature,
wherein the divided material which is temporarily bonded in the liquid phase diffusion boding is formed as an integrated material in the solid phase diffusion bonding step.
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