CPC B23K 26/042 (2015.10) [B23K 26/032 (2013.01); B23K 26/0823 (2013.01); H01L 21/02021 (2013.01); H01L 21/681 (2013.01); H01L 22/12 (2013.01)] | 7 Claims |
1. A substrate treating apparatus comprising:
a chamber configured to provide a space in which a substrate is treated;
a support unit configured to support the substrate inside the chamber;
a laser unit configured to irradiate laser to an edge region of the substrate;
a vision unit configured to capture the edge region of the substrate to measure an offset value of the substrate; and
an adjustment unit including a body that is configured to rotate to adjust an irradiation location of the laser based on the offset value of the substrate,
wherein the adjustment unit generates a profile for the offset value corresponding to a spin angle of the substrate and adjusts the irradiation location of the laser based on the profile with respect to a slope of the body that is calculated using the offset value and a distance between the substrate and the adjustment unit.
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