US 11,679,447 B2
Apparatus and method for treating substrate
Soo Young Park, Incheon (KR); Ohyeol Kwon, Chungcheongnam-do (KR); Jun Keon Ahn, Sejong-si (KR); and Jung Hwan Lee, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Apr. 29, 2020, as Appl. No. 16/861,709.
Claims priority of application No. 10-2019-0050336 (KR), filed on Apr. 30, 2019.
Prior Publication US 2020/0346299 A1, Nov. 5, 2020
Int. Cl. B23K 26/042 (2014.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); H01L 21/02 (2006.01); H01L 21/68 (2006.01); H01L 21/66 (2006.01)
CPC B23K 26/042 (2015.10) [B23K 26/032 (2013.01); B23K 26/0823 (2013.01); H01L 21/02021 (2013.01); H01L 21/681 (2013.01); H01L 22/12 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a chamber configured to provide a space in which a substrate is treated;
a support unit configured to support the substrate inside the chamber;
a laser unit configured to irradiate laser to an edge region of the substrate;
a vision unit configured to capture the edge region of the substrate to measure an offset value of the substrate; and
an adjustment unit including a body that is configured to rotate to adjust an irradiation location of the laser based on the offset value of the substrate,
wherein the adjustment unit generates a profile for the offset value corresponding to a spin angle of the substrate and adjusts the irradiation location of the laser based on the profile with respect to a slope of the body that is calculated using the offset value and a distance between the substrate and the adjustment unit.