US 11,678,470 B2
Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
Hoang Dinh Do, Canton, MA (US); Robert Howard Boutier, Jr., Westport, MA (US); Jason L. Strader, Cleveland, OH (US); and Michael S. Plante, Grafton, MA (US)
Assigned to Laird Technologies, Inc., Chesterfield, MO (US)
Filed by Laird Technologies, Inc., Chesterfield, MO (US)
Filed on Jan. 17, 2022, as Appl. No. 17/577,265.
Application 17/577,265 is a continuation of application No. 14/928,189, filed on Oct. 30, 2015, granted, now 11,229,147.
Application 14/928,189 is a continuation in part of application No. 14/683,870, filed on Apr. 10, 2015, abandoned.
Claims priority of provisional application 62/112,758, filed on Feb. 6, 2015.
Prior Publication US 2022/0142020 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09D 5/14 (2006.01); H05K 9/00 (2006.01); C09K 5/14 (2006.01)
CPC H05K 9/0081 (2013.01) [C09K 5/14 (2013.01); H05K 9/0083 (2013.01)] 31 Claims
 
1. A thermally-conductive electromagnetic interference (EMI) absorber comprising a matrix loaded with thermally-conductive particles, EMI absorbing particles, and silicon carbide, wherein the silicon carbide is present in a predetermined amount sufficient to synergistically enhance both thermal conductivity and EMI absorption, wherein the EMI absorbing particles comprise carbonyl iron, and the thermally-conductive particles comprise alumina;
wherein:
the thermally-conductive EMI absorber includes at least about 6 volume percent of the alumina, at least about 8 volume percent of the carbonyl iron, and at least about 21 volume percent of the silicon carbide; or
the thermally-conductive EMI absorber includes about 2 to 4 volume percent of magnetic flakes, about 3 to 5 volume percent of the carbonyl iron, about 18 to 23 volume percent of the alumina, about 27 to 40 volume percent of manganese zinc ferrite, and about 4 to 10 volume percent of the silicon carbide.