US 11,678,468 B2
High density power module
Benoit Blanchard St-Jacques, Sainte-Julie (CA); Francois Dube, Montreal (CA); and Marc-Antoine Beaupre, Saint-Lambert (CA)
Assigned to DANA TM4 INC., Boucherville (CA)
Filed by DANA TM4 INC., Boucherville (CA)
Filed on Sep. 24, 2020, as Appl. No. 17/31,041.
Prior Publication US 2022/0095493 A1, Mar. 24, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01)
CPC H05K 7/20927 (2013.01) [H01L 24/45 (2013.01); H01L 25/0655 (2013.01); H05K 1/0207 (2013.01); H05K 1/0231 (2013.01); H01L 23/3735 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A half-bridge power module, comprising:
a first terminal arranged at a first side of the power module and a second terminal arranged at a second, opposite side of the power module;
a plurality of semiconductor chips arranged in a first printed circuit board (PCB) between the first terminal and the second terminal, along a first axis parallel with a plane of the first PCB, and between a top plate and a baseplate along a second axis, perpendicular to the first axis, the first PCB connected to the baseplate via a connection point at a rear side of the power module;
a phase output busbar arranged at a front side of the power module that is opposite the rear side and so as to protrude beyond an edge of the first PCB, the top plate, and the baseplate;
a first capacitor electrically coupled to each of the first terminal and the second terminal and arranged above, with respect to the second axis, and in contact with the top plate;
a second capacitor coupled to the first terminal and a first conductive layer of the first PCB, the second capacitor positioned proximate to the first terminal and the top plate with the first capacitor arranged thereabove, with respect to the second axis;
a third capacitor coupled to the second terminal and the first conductive laver of the first PCB, the second capacitor positioned proximate to the second terminal and the top plate with the first capacitor arranged thereabove, with respect to the second axis, the second and third capacitors each spaced away from one another with the connection point therebetween and arranged at the rear side of the power module; and
one or more connectors coupled to the first PCB and configured to electrically couple the half-bridge power module to electrical circuits external to the half-bridge power module;
wherein the phase output busbar provides one phase output for the half-bridge power module, and the half-bridge power module is configured to be scalable by coupling to additional half-bridge power modules to form a multiphase power module with more additional phase outputs.