US 11,678,467 B2
Front accessible fan tray with front-to-back cooling in a modular electronic system
Rohit Dev Gupta, Bangalore (IN)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed on Jan. 25, 2021, as Appl. No. 17/157,574.
Application 17/157,574 is a division of application No. 16/030,527, filed on Jul. 9, 2018, granted, now 11,096,314.
Prior Publication US 2021/0153387 A1, May 20, 2021
Int. Cl. H05K 7/20 (2006.01); H05K 7/16 (2006.01); H05K 7/14 (2006.01); H04B 10/40 (2013.01)
CPC H05K 7/20581 (2013.01) [H05K 7/1401 (2013.01); H05K 7/16 (2013.01); H04B 10/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a fan tray comprising a plurality of fans for cooling modules within a modular electronic system with airflow from a front of the modular electronic system to a back of the modular electronic system; and
a hinge member for connecting the fan tray to a first side of a front panel of the modular electronic system with the plurality of fans positioned in front of the modules;
wherein the fan tray is rotatable on the hinge member for movement away from the front panel to allow for replacement of one of the modules,
wherein a plurality of optical transceivers are installed in the front panel, the plurality of optical transceivers being adjacent to and directly exposed to the plurality of fans, each optical transceiver being coupled to an associated cable of a plurality of cables, and
wherein the front panel includes an opening on a second side of the front panel opposite the first side, the plurality of cables coupled to the plurality of optical transceivers pass through the opening, and the opening is sealed around the plurality of cables.