US 11,678,466 B2
Heat sink for optical module
Rohit Dev Gupta, Bangalore (IN); Narasimha Reddy Emmareddy, Bangalore (IN); Manjunatha Reddy Shivashankara, Bangalore (IN); Suresh Kumar Vadivazhagan, Bangalore (IN); and Giovanni Giobbio, Rovellasca (IT)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed on May 24, 2021, as Appl. No. 17/329,043.
Claims priority of provisional application 63/109,000, filed on Nov. 3, 2020.
Prior Publication US 2022/0141990 A1, May 5, 2022
Int. Cl. H05K 7/20 (2006.01); H01R 13/516 (2006.01); G02B 6/42 (2006.01)
CPC H05K 7/2039 (2013.01) [H01R 13/516 (2013.01); G02B 6/4269 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a heat sink for attachment to an optical module cage configured for receiving an optical module;
a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module; and
a plurality of lifting elements extending from the surface of the heat sink;
wherein said plurality of lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, said plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate said gap and provide contact between the optical module and the thermal interface material.