CPC H05K 7/2039 (2013.01) [H01R 13/516 (2013.01); G02B 6/4269 (2013.01)] | 21 Claims |
1. An apparatus comprising:
a heat sink for attachment to an optical module cage configured for receiving an optical module;
a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module; and
a plurality of lifting elements extending from the surface of the heat sink;
wherein said plurality of lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, said plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate said gap and provide contact between the optical module and the thermal interface material.
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